Ingredients
Silicone Compounds: 50%
Carbon Compounds: 30%
Metal Oxide Compounds: 20%

Specifications
Thermal Conductivity: ＞1.93 W/m-K
Thermal Impedance: ＜0.225 0C-in²/W
Specific Gravity: ＞2g/cm³
Viscosity: 1000
Thixotropic Index: 380±10 to 1/10mm
Moment Bore Temperature: -50~300 C
Operation Temperature: -30~280 0C